Pick-up Process Analysis of a Die Bonder: with Dynamic Computer Simulation and Taguchi Method - Sheng-jye Hwang - Books - VDM Verlag Dr. Müller - 9783639000344 - April 22, 2008
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Pick-up Process Analysis of a Die Bonder: with Dynamic Computer Simulation and Taguchi Method

Sheng-jye Hwang

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Pick-up Process Analysis of a Die Bonder: with Dynamic Computer Simulation and Taguchi Method

The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic; Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth; the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle; and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms; even a new procedure could be derived for the next generational die bonder.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released April 22, 2008
ISBN13 9783639000344
Publishers VDM Verlag Dr. Müller
Pages 136
Dimensions 190 g
Language English