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Advanced Thermal Stress Analysis of Smart Materials and Structures 1st ed. 2020 edition
Chen
Advanced Thermal Stress Analysis of Smart Materials and Structures 1st ed. 2020 edition
Chen
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.
304 pages, 10 Tables, color; 44 Illustrations, color; 60 Illustrations, black and white; X, 304 p. 1
Media | Books Book |
Released | September 19, 2019 |
ISBN13 | 9783030252007 |
Publishers | Springer Nature Switzerland AG |
Pages | 304 |
Dimensions | 616 g |
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